QS-200 with   
Rotation Covered Chuck Technology

• Spinner System for Coating, Cleaning or Developing applications
• wafers up to Ø 8” (Ø 200mm) and subtrates up to 6"x 6"(150x150mm)

Features:

• Spinner System with RccT and automatic substrate pin lift
• easy to clean multi part process chamber made of HP* material
• Separate Electronic controller cabinet
• Separate operator controller with colour touch display
• Start, Stop and Vacuum on/of functions directly at the process module
• Strong, direct drive brushless spinner motor
• Turbulence free process area
• No photoresist splash or dust on the cover plate, assur-ing a particle-free coating
• Unit directly on the media arm mounted close to point of use to control dispense rate.
• Programmable process parameters (motion and media)
• Unlimited numbers of recipe (easy more expandable by USB Stick)
• Standard up to 50 programmable recipe steps
• Recipe step time: 0.1s -> 999sec (steps 0.1 sec)
• USB and Ethernet interface for easy data storage and recipe transfer
• Terminal for EMO external via Bench supply (integrated as option)
• CE Marked
• Manual in English or any EU language
• vacuum sensor for safety interrupt and a visible vacuum gauge * High Purity

Technical Data:
Voltage:                               230VAC / 50Hz or 110VAC / 60Hz
Speed:                                1 up to 10.000rpm in 1rpm steps
                                             (depends on substrate weight and size)
Acceleration Ramp:         1 up to 50.000 rpm/sec in steps 1rpm/sec
                                             (depends on substrate weight and size)
Spinning Time:                 0,1 up to 999sec in 0,1sec steps
Substrate Size:                  up to Ø 8” (Ø 200mm) or 6” x 6” (150 x 150mm)