Hotplate Quickstep 200 xx  300°C   - QS H 200

with pneumatic or electronic lift pins

The standard solar-semi hotplate QS H 200 has been developed for standard softbake or hardbake for lithography processes or similar other applications.

The standard module is equipped with a lift pin unit to move substrates up and down. The PID temperature controller combined with the sandwich manufactured hotplate,   cover a temperature range from ambient up to 300°C with a very high uniformity across the 200 mm wafer. With the modular design and the wide range of auxiliary options we cover the needs for all hotplate process in the field.

Features:

•   Process module for integration into existing frame, as bench-, or standalone module

• Wafer size up to Ø 8“ (Ø 200 mm) or substrate size up to 6“ x 6“ (150 mm x 150mm)

• Safety cover/lid made of mirrored stainless steel for temperature covering and safety

• Hard coated surface with non-stick technology

• Vacuum channels on the surface for substrate fixing  

• Lift pins for easy handling and safe process control 

• Time and temperature controlled

• Narate control box necessary

• CE marked

• Manual in English (printed on standard paper and on USB-Stick)

• easy to install and to maintain

• levelling feature including

configuration options

Technical Data:

Voltage :                                     230VAC / 50Hz or 208VAC / 60Hz

Temperature range:                up to 300°C in 1°C steps Hotplate time 1 up to 9999sec in 1sec steps

Substrate size:                         wafers up to Ø 8” (Ø 200mm) and substrates up to 6” x 6” (150 x 150mm)

Exhaust:                                    OD 38mm, 30m³/h

Pressure:                                 Clean dry air (CDA) 8bar

Vacuum:                                   -0.8bar

Nitrogen:                                  4.5 ± 0.2bar (option)

Dimensions (W x D x H)

- Hotplate module: approx. 470 x 365 x 420mm (18.5” x 14.5” x 16.5”)

- Electronic control unit: 180 x 180 x 90mm (7” x 7” x 3.5”)