Hotplate Quickstep 200 xx 300°C - QS H 200
The standard solar-semi hotplate QS H 200 has been developed for standard softbake or hardbake for lithography processes or similar other applications.
The standard module is equipped with a lift pin unit to move substrates up and down. The PID temperature controller combined with the sandwich manufactured hotplate, cover a temperature range from ambient up to 300°C with a very high uniformity across the 200 mm wafer. With the modular design and the wide range of auxiliary options we cover the needs for all hotplate process in the field.
Voltage : 230VAC / 50Hz or 208VAC / 60Hz
Temperature range: up to 300°C in 1°C steps Hotplate time 1 up to 9999sec in 1sec steps
Substrate size: wafers up to Ø 8” (Ø 200mm) and substrates up to 6” x 6” (150 x 150mm)
Exhaust: OD 38mm, 30m³/h
Pressure: Clean dry air (CDA) 8bar
Nitrogen: 4.5 ± 0.2bar (option)
Dimensions (W x D x H)
- Hotplate module: approx. 470 x 365 x 420mm (18.5” x 14.5” x 16.5”)
- Electronic control unit: 180 x 180 x 90mm (7” x 7” x 3.5”)